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Posted By<" ">Ben on December 17, 2001 at 23:42:50:
Hi,
I am an electronic engineer and puzzled by "metal migration" problem on component leads coating. it is highly appreciated if any one can give me some idea on the following phenomenon:
The lead is copper alloy and coated with tin-lead plating. After a high temperature (~60 - 80C) process for hours, the solderability decreases due to zine migration from the alloy to the surface.
Here is my questions:
1. Does the decrease in solderability be caused by zine migration? Or do those metals can be migrated so easy?
2. Does the "high temperature", only 60 - 80C for several hours, cause such metal migration? Or other reason?
Thank you in advance if any anybody can help.
Cheers,
Ben
Subject: Re: Zine migration
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